Annual Bloomberg Bucket Event 2013

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A silicon wafer, a thin slice of semiconductor material used in... Fotografía de noticiasAmérica del norte,California,Dispositivo de información móvil,EE.UU.,Finanzas,Fino,Horizontal,Internet,Irvine,Las Américas,Material,Rebanada,Sede central,Semiconductor,Silicio,Tecnología,Tecnología inalámbricaPhotographer Collection: Bloomberg 2013 BloombergA silicon wafer, a thin slice of semiconductor material used in integrated circuits, is displayed at the headquarters of Broadcom Corp. in Irvine, California, U.S., on Friday, April 12, 2013. Broadcom Corp. is a maker of chips that help mobile devices connect to the Internet. Photographer: Patrick T. Fallon/Bloomberg via Getty Images